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SiC As-cut Substrate Wafer
Diameter: 150mm
Type: N type or SI type
Thickness: 600um
Package: Cassette -
碳化硅切割片
直径:100mm/150mm
厚度:440um/480um
等级:测试级/研究级/产品级
类型:导电N型/半绝缘SI型 -
4inch SiC As-cut Substrate
Diameter: 100mm
Type: N type or SI type
Thickness: 440um
Package: Cassette -
Dummy Grade SiC Ingots
Diameter:100±0.25mm
Grade: Dummy Grade
Type: 4H-N / 4H-SI
Thickness: Min ≥15mm -
测试D级碳化硅晶锭晶棒
直径:100±0.25mm
厚度: Min ≥15mm
等级:测试D级
类型:4H-N导电型;4H-SI半绝缘型 -
Production Grade SiC Ingots
Diameter:150±0.2mm
Grade: Production Grade
Type: 4H-N / 4H-SI
Thickness: Min ≥15mm -
产品P级碳化硅晶锭晶棒
直径:150±0.2mm
厚度: Min ≥15mm
等级:产品级P级
类型:4H-N导电型;4H-SI半绝缘型 -
2 Inch GaN-On-Sapphire Template
Dimensions: Ф 50.8 mm ± 1 mm
Thickness:4.5µm, 20 µm
Orientation:C-plane(0001) ± 0.5°
Useable Surface Area:> 90% -
氮化镓晶片 蓝宝石氮化镓衬底晶片
尺寸:2英寸
厚度:4.5um 20um
掺杂:非掺杂,硅掺杂,镁掺杂
衬底结构:GaN-On-Sapphire
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4 Inch GaN-On-Sapphire Template
Dimensions: Ф 100 mm ± 0.1 mm
Thickness:4.5 µm, 20 µm
Orientation:C-plane(0001) ± 0.5°
Useable Surface Area:> 90% -
氮化镓衬底晶片 4英寸GaN氮化镓衬底片
尺寸:4英寸
厚度:4.5um 20um
掺杂:非掺杂,硅掺杂
衬底结构:GaN-On-Sapphire -
2 Inch Free-Standing GaN Substrate
Dimensions: Ф 50.8 mm ± 1 mm
Thickness: 350 ± 25 µm
Useable Surface Area: > 90%
Total Thickness Variation: ≤ 15 µm -
氮化镓自支撑晶片 2英寸GaN衬底晶片
尺寸:2英寸
厚度:350um
掺杂:非掺杂,硅掺杂,铁掺杂
等级:测试级,研究级,产品级,优选级
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4 Inch Free-Standing GaN Substrate
Dimensions: Ф 100 mm ± 1 mm
Thickness: 400 ± 50 µm
Useable Surface Area: > 90%
Total Thickness Variation: ≤ 40 µm -
氮化镓自支撑衬底片 4英寸GaN氮化镓晶片
尺寸:4英寸
厚度:400um
掺杂:非掺杂,硅掺杂
电阻率:≤0.5Ω.cm
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Square Free-Standing GaN Substrate
Dimension:10*15mm²
Thickness: 350±25um
Useable Surface Area:>90%
Conduction Type: N Type,SI Type