2 inch As Cut SiC Wafer T-1100um

HMT company not only produce SiC Boules but also supply 2 inch As-cut SiC Wafer(Without Lapping and Polishing) with conductive N type to the worldwide. We can provide high quanlity of raw cut 2 inch SiC wafer with 600um 900um 1100um 1200um thickness etc. The raw cut SiC wafers were slicing from SiC boules directly and witout lapping and polishing process. You can test diamond grinding, newest polishing materials and so on. Meanwhile, if you need other dimension of unpolished SiC wafer such as 4 inch 6 inch and nesest 8 inch, please contact us immediately！

Spec:

Product Name: As-cut SiC Wafer
Brand Name: HMT
Model : 2 INCH
Place of Origin: CHINA
Price: Contact us
Packaging Details: Cassette
Delivery Time: 30 days
Payment Terms: T/T
Customized: Support
Surface Orientation: 4°toward <11-20>±0.5°
Front: Si Face
Back: C Face
Dopant: N-typeNitrogen

Support and Services:

Our As-cut SiC Wafer product comes with comprehensive technical support and services to ensure reliable and efficient performance in your applications. Our team of experienced engineers and technicians are available to assist you with:

• Product selection and customization
• Material characterization and analysis
  
• Quality control and assurance