SiC As-cut Wafer Supplier and Manufacturer_Raw cut 4 inch SiC wafer manufacturer

4H-N Raw-cut SiC Wafer

Diameter: 50.8mm 100mm 150mm 200mm
Type: 4H-N Conductive
Thickness:400um 600um 900um 厚度定制
Package: Cassette
As-Cut Wafer SiC Processing Parts Manufacturer

Grade: D R P
Dimension: 2 inch to 8 inch
Type: 4H-N
Thickness: 500um 800um 900um etc
6 inch Unpolished SiC Wafer T-900um

Diameter: 150mm
Type: 4H-N Conductive
Thickness: About 900um
Package: Cassette
2 inch As Cut SiC Wafer T-1100um

Diameter: 50.8mm
Type: 4H-N Conductive
Thickness: About 1100um 定制厚度
Package: Cassette
2 Inch Raw Cut SiC Wafer T-1200um

Diameter: 50.8mm
Type: 4H-N Conductive
Thickness: About 1200um
Package: Cassette
2 inch Raw-Cut SiC Wafer T-900um

Diameter: 50.8mm
Type: 4H-N Conductive
Thickness: About 900um
Package: Cassette
碳化硅As-cut切割晶片

直径: 150mm
类型: N type or SI type
厚度: 600um 900um 定制厚度
包装: 卡塞盒
SiC As-cut Substrate Wafer

Diameter: 100mm 150mm 200mm
Type: SI type
Thickness: About 600um
Package: Cassette
碳化硅切割片

直径：100mm/150mm
厚度：440um/480um
等级：测试级/研究级/产品级
类型：导电N型/半绝缘SI型
4inch SiC As-cut Substrate

Diameter: 100mm
Type: N type or SI type
Thickness: 440um
Package: Cassette

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