GaN Epitaxial On Si For Power HEMT D-Mode
GaN-On-Si Epi Wafer For Power HEMT
Substrate Diameter: 2inch,4inch,6inch,8inch
Substrate Thickness: 675um,1000um
Epi Layer Total Thickness:2~5.5um
Product Description
As the leading manufacturer and supplier of GaN (Gallium Nitride) Epi (Epitaxial) wafer and GaN-On-Si Epi Wafer For Power HEMT application. Homray Material Technology offers 2inch~8inch GaN on Si Epiwafer for D-Mode Power HEMT. The HMT650V product is a state-of-the-art (Al,Ga)N/GaN heteroepitaxial layer structure deposited crack-free on a (111) Si-wafer for high voltage power switching applications. Homray Material Technology offers two standard HEMT structures: one having an Al0.25Ga0.75N barrier w/o an AlN spacer layer and the other having an Al0.25Ga0.75N barrier with an AlN spacer layer. Custom barrier, cap layer and in-situ SiN designs are available upon request.
GaN Epi Wafer Application
- 5G-related RF devices, such as power amplifier
- High-efficiency power electronics devices, such as power supplies, DC/DC converter, etc.
- Durable and reliable devices in harsh environments
- High-end sensor devices
Standard Layer Structure For Power HEMT D-Mode Key Features
Standard Layer Specifications For Power HEMT D-Mode
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